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化學材料

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

041041.A3 / 2kg
CAS：7446-31-3
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Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

041045.KS / 1each
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Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041050.KS / 1each
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Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

041054.KS / 1each
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Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041063.KS / 1each
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

041064.KS / 1each
CAS：50926-11-9
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

041065.KS / 1each
CAS：50926-11-9
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

041072.KS / 1each
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

041073.KS / 1each
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Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

041080.KS / 1each
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Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

041084.KS / 1each
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Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041088.KS / 1each
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Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041090.KS / 1each
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Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041093.KS / 1each
CAS：10097-28-6
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

041096.KS / 1each
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041097.KS / 1each
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Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041099.KS / 1each
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Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041103.KS / 1each
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041110.KS / 1each
CAS：25583-20-4
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041111.KS / 1each
CAS：25583-20-4
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041123.KS / 1each
CAS：1314-13-2
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041124.KS / 1each
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Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041126.KS / 1each
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KD / 50pc
CAS：7440-31-5
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KK / 10pc
CAS：7440-31-5
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KK / 10pc
CAS：7440-31-5
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.03 / 1g
CAS：99685-96-8
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.06 / 5g
CAS：99685-96-8
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.MD / 250mg
CAS：99685-96-8
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Fullerene powder, hydroxylated, C{60}(OH)|n,

Fullerene powder, hydroxylated, C{60}(OH)|n,

041182.MB / 25mg
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Fullerene powder, hydroxylated, C{60}(OH)|n,

Fullerene powder, hydroxylated, C{60}(OH)|n,

041182.MC / 100mg
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Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

041202.03 / 1g
CAS：142617-53-6
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Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

041202.06 / 5g
CAS：142617-53-6
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Bismuth(III) tert-pentyloxide, 97+%

Bismuth(III) tert-pentyloxide, 97+%

041203.03 / 1g
CAS：124687-44-1
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.09 / 10g
CAS：7440-50-8
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.22 / 100g
CAS：7440-50-8
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.36 / 500g
CAS：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.09 / 10g
CAS：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.18 / 50g
CAS：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.30 / 250g
CAS：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.A1 / 1kg
CAS：7440-50-8
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.BU / 25cm
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.BW / 50cm
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.G1 / 1m
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3-Trimethylsilyl-2-oxazolidinone

3-Trimethylsilyl-2-oxazolidinone

041209.03 / 1G
CAS：43112-38-5
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.09 / 10g
CAS：68959-06-8
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.18 / 50g
CAS：68959-06-8
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.30 / 250g
CAS：68959-06-8
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Carbon conductive cement adhesive

Carbon conductive cement adhesive

041212.15 / 30g
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Graphite adhesive, aqueous based

Graphite adhesive, aqueous based

041214.18 / 50G
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LOCATIONS

服務據點

北北基/宜蘭/花蓮
  • 北北基/宜蘭/花蓮
  • 桃園
  • 新竹縣/新竹市/苗栗
  • 台中/彰化/南投
  • 雲林/嘉義/台南
  • 高雄/屏東/台東

台北分公司

地址 台北市南港區南港路三段50巷10號5樓
電話 02-2786-2331
傳真 02-2653-6959
郵件 taipei@echochemical.com

桃園分公司

地址 桃園市平鎮區復興街62號2樓
電話 03-494-6939
傳真 03-493-0687
郵件 chungli@echochemical.com

總公司 / 竹苗分公司

地址 苗栗縣頭份市工業路16號
電話 037-621-088
傳真 037-615-096
郵件 miaoli@echochemical.com

台中分公司

地址 台中市南屯區文心路一段218號15F之2
電話 04-2472-8859
傳真 04-2472-8825
郵件 taichung@echochemical.com

台南分公司

地址 台南市永康區鹽洲一街63巷33號
電話 06-243-6589
傳真 06-253-8208
郵件 tainan@echochemical.com

高雄分公司

地址 高雄市鳳山區鳳頂路479號
電話 07-753-9988
傳真 07-753-1958
郵件 kaohsiung@echochemical.com
北北基/宜蘭/花蓮 桃園 新竹縣/新竹市/苗栗 台中/彰化/南投 雲林/嘉義/台南 高雄/屏東/台東
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