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化學材料

Rhodium(III) sulfate tetrahydrate, Premion®, 99.99% (metals basis), Rh 35.9% min

Rhodium(III) sulfate tetrahydrate, Premion®, 99.99% (metals basis), Rh 35.9% min

041016.03 / 1G
CAS：15274-78-9
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Rhodium(III) sulfate tetrahydrate, Premion®, 99.99% (metals basis), Rh 35.9% min

Rhodium(III) sulfate tetrahydrate, Premion®, 99.99% (metals basis), Rh 35.9% min

041016.06 / 5G
CAS：15274-78-9
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Lead Tin, solder alloy, 3.18mm (0.125in) dia

Lead Tin, solder alloy, 3.18mm (0.125in) dia

041023.TB / 113G
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Lead Tin, solder alloy, 1.6mm (0.06in) dia, with rosin core

Lead Tin, solder alloy, 1.6mm (0.06in) dia, with rosin core

041024.29 / 225G
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Lead Tin, solder alloy, 1.6mm (0.06in) dia, with rosin core

Lead Tin, solder alloy, 1.6mm (0.06in) dia, with rosin core

041024.TB / 113G
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Silver, brazing alloy, 0.8mm (0.03in) dia

Silver, brazing alloy, 0.8mm (0.03in) dia

041026.10 / 15G
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Silver, solder alloy, 3.0mm (0.13in) dia

Silver, solder alloy, 3.0mm (0.13in) dia

041030.18 / 50G
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Silver, solder alloy, 3.0mm (0.13in) dia

Silver, solder alloy, 3.0mm (0.13in) dia

041030.30 / 250G
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Silver, solder alloy, 3.0mm (0.13in) dia

Silver, solder alloy, 3.0mm (0.13in) dia

041030.TD / 454G
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Silver, solder alloy, 1.6mm (0.06in) dia

Silver, solder alloy, 1.6mm (0.06in) dia

041032.18 / 50G
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Silver, solder alloy, 1.6mm (0.06in) dia

Silver, solder alloy, 1.6mm (0.06in) dia

041032.30 / 250G
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Silver, solder alloy, 1.6mm (0.06in) dia

Silver, solder alloy, 1.6mm (0.06in) dia

041032.36 / 500G
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Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

041038.G1 / 1M
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Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

041038.G5 / 5M
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Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%

041038.G6 / 10M
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Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

041039.G1 / 1M
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Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

041039.G5 / 5M
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Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%

041039.G6 / 10M
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Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

041040.8G / *5X10CM
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Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

041040.BS / 10CM
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Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

Tungsten wire, chromium plated, 1.8mm (0.07in) min dia, W 96.5+%, Cr 99.888% (metals basis)

041040.D@ / *10X10CM
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Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

041041.22 / 100G
CAS：7446-31-3
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Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

041041.36 / 500G
CAS：7446-31-3
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Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

041041.A3 / 2KG
CAS：7446-31-3
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Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

041045.KS / 1EACH
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Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041050.KS / 1EACH
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Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

041054.KS / 1EACH
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Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041063.KS / 1EACH
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

041064.KS / 1EACH
CAS：50926-11-9
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

041065.KS / 1EACH
CAS：50926-11-9
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

041072.KS / 1EACH
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

041073.KS / 1EACH
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Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

041080.KS / 1EACH
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Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

041084.KS / 1EACH
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Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041088.KS / 1EACH
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Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041090.KS / 1EACH
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Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041093.KS / 1EACH
CAS：10097-28-6
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

041096.KS / 1EACH
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041097.KS / 1EACH
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Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041099.KS / 1EACH
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Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041103.KS / 1EACH
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Tellurium(IV) ethoxide, tech. 85%, remainder ethanol

Tellurium(IV) ethoxide, tech. 85%, remainder ethanol

041105.04 / 2G
CAS：2017-01-8
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Tellurium(IV) ethoxide, tech. 85%, remainder ethanol

Tellurium(IV) ethoxide, tech. 85%, remainder ethanol

041105.09 / 10G
CAS：2017-01-8
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041110.KS / 1EACH
CAS：25583-20-4
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041111.KS / 1EACH
CAS：25583-20-4
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041123.KS / 1EACH
CAS：1314-13-2
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041124.KS / 1EACH
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Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041126.KS / 1EACH
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KD / 50PC
CAS：7440-31-5
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KK / 10PC
CAS：7440-31-5
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