Tantalum pellet, 1mm (0.04in) dia x 2mm (0.08in), 99.9% (metals basis)
044367.KO / 1000PC
CAS No.:7440-25-7
Silicon powder, crystalline, APS |<50nm, 98%, Laser synthesized from vapor phase
044384.04 / 2G
CAS No.:7440-21-3
Silicon powder, crystalline, APS |<50nm, 98%, Laser synthesized from vapor phase
044384.09 / 10G
CAS No.:7440-21-3
Silicon powder, crystalline, APS |<50nm, 98%, Laser synthesized from vapor phase
044384.18 / 50G
CAS No.:7440-21-3
Poly(styrene-divinylbenzene), aminomethylated, 1% cross-linked, 100-200 mesh
044392.06 / 5G
CAS No.:89551-24-6
Poly(styrene-divinylbenzene), aminomethylated, 1% cross-linked, 100-200 mesh
044392.14 / 25G
CAS No.:89551-24-6
Poly(styrene-divinylbenzene), aminomethylated, 1% cross-linked, 200-400 mesh
044394.06 / 5G
CAS No.:89551-24-6
Poly(styrene-divinylbenzene), aminomethylated, 1% cross-linked, 200-400 mesh
044394.06 / 5G
CAS No.:89551-24-6
Platinum sputtering target, 25.4mm (1.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)
044399.KS / 1EACH
CAS No.:7440-06-4
Platinum sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)
044400.KS / 1EACH
CAS No.:7440-06-4
Platinum sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)
044401.KS / 1EACH
CAS No.:7440-06-4
Gold sputtering target, 25.4mm (1.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)
044403.KS / 1EACH
CAS No.:7440-57-5
Gold sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)
044404.KS / 1EACH
CAS No.:7440-57-5
Gold sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)
044405.KS / 1EACH
CAS No.:7440-57-5