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Chemical materials

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

Zirconium(IV) sulfate tetrahydrate, 98+% (metals basis)

041041.A3 / 2kg
CAS No.：7446-31-3
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Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

Aluminum oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis)

041045.KS / 1each
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Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Boron carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041050.KS / 1each
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Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis)

041054.KS / 1each
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Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Chromium silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041063.KS / 1each
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.13in) thick, 99.99% (metals basis)

041064.KS / 1each
CAS No.：50926-11-9
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Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

Indium tin oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.25in) thick, 99.99% (metals basis)

041065.KS / 1each
CAS No.：50926-11-9
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis excluding Ca)

041072.KS / 1each
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Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

Magnesium oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)

041073.KS / 1each
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Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)

041080.KS / 1each
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Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)

041084.KS / 1each
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Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041088.KS / 1each
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Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Silicon(IV) nitride, MgO binder, sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041090.KS / 1each
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Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Silicon(II) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041093.KS / 1each
CAS No.：10097-28-6
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis)

041096.KS / 1each
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Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041097.KS / 1each
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Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

Silicon(IV) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

041099.KS / 1each
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Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Tantalum(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041103.KS / 1each
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)

041110.KS / 1each
CAS No.：25583-20-4
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Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

Titanium nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)

041111.KS / 1each
CAS No.：25583-20-4
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)

041123.KS / 1each
CAS No.：1314-13-2
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Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041124.KS / 1each
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Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

Zinc oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.9% (metals basis)

041126.KS / 1each
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KD / 50pc
CAS No.：7440-31-5
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KK / 10pc
CAS No.：7440-31-5
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Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

Tin slug, 11mm (0.43in) dia x 2mm (0.1in) thick, Puratronic®, 99.995% (metals basis)

041169.KK / 10pc
CAS No.：7440-31-5
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.03 / 1g
CAS No.：99685-96-8
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.06 / 5g
CAS No.：99685-96-8
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Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

Fullerene powder, mixed refined, typically 70% C{60}, 28% C{70}, higher 2%

041181.MD / 250mg
CAS No.：99685-96-8
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Fullerene powder, hydroxylated, C{60}(OH)|n,

Fullerene powder, hydroxylated, C{60}(OH)|n,

041182.MB / 25mg
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Fullerene powder, hydroxylated, C{60}(OH)|n,

Fullerene powder, hydroxylated, C{60}(OH)|n,

041182.MC / 100mg
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Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

041202.03 / 1g
CAS No.：142617-53-6
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Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)bismuth(III), 99.9%

041202.06 / 5g
CAS No.：142617-53-6
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Bismuth(III) tert-pentyloxide, 97+%

Bismuth(III) tert-pentyloxide, 97+%

041203.03 / 1g
CAS No.：124687-44-1
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.09 / 10g
CAS No.：7440-50-8
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.22 / 100g
CAS No.：7440-50-8
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Copper flake, 1-5 micron, 99.9% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)

041204.36 / 500g
CAS No.：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.09 / 10g
CAS No.：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.18 / 50g
CAS No.：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.30 / 250g
CAS No.：7440-50-8
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Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

041205.A1 / 1kg
CAS No.：7440-50-8
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.BU / 25cm
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.BW / 50cm
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Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)

041206.G1 / 1m
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3-Trimethylsilyl-2-oxazolidinone

3-Trimethylsilyl-2-oxazolidinone

041209.03 / 1G
CAS No.：43112-38-5
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.09 / 10g
CAS No.：68959-06-8
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.18 / 50g
CAS No.：68959-06-8
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Di-sec-butoxyaluminoxytriethoxysilane

Di-sec-butoxyaluminoxytriethoxysilane

041210.30 / 250g
CAS No.：68959-06-8
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Carbon conductive cement adhesive

Carbon conductive cement adhesive

041212.15 / 30g
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Graphite adhesive, aqueous based

Graphite adhesive, aqueous based

041214.18 / 50G
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